Job Description (JD)
| Nama Program | Operasi Fabrikasi Wafer Bahagian Hadapan [EE-022-4:2012] |
|---|---|
| Kod CU | EE-022-4:2012-C01 |
| Competency | Core |
| Tajuk CU | Wafer Fabrication Process Operation |
| Penerangan CU | The CU title describes the competency in Wafer Fabrication Process Operation. He or she able to carry out the routine tasks related to wafer fabrication operation. The person who is competent in this CU shall be able to Practice clean room protocol; Perform equipment qualification; Register the Interrupt Lot Processing (ILP) detail information in specified document (ex: CADET System); Extract the ILP data collection; Metrology recipe creation; Execute qualification/ Proto (PRT) lot run; Special Engineering Request Instruction (SERI) lot run; Identify the discrepancy base on Recipe Management System (RMS) failure; Execute the Temporary Engineering Instruction(TEI)/ Engineering Change Request (ECR); Inspection tool recipe creation (defect scan, dark field and bright field). The outcome of this competency is to ensure the wafers is produced in accordance with SOP, customer requirement under normal operating condition. |
| Tempoh Latihan | 1056 |
| Objektif Pembelajaran | The person who is competent in this CU shall be able to operate routine tasks related to wafer fabrication operation. Upon completion of this competency unit, trainees will be able to:- 1. Practice cleanroom protocol 2. Perform equipment qualification 3. Register the Interrupt Lot Processing (ILP) detail information in specified document (ex: CADET System) 4. Extract the ILP data collection 5. Metrology recipe creation 6. Execute qualification/ Proto (PRT) lot run 7. Special Engineering Request Instruction (SERI) lot run 8. Identify the discrepancy base on Recipe Management System (RMS) failure 9. Execute the Temporary Engineering Instruction(TEI)/ Engineering Change Request (ECR) 10. Inspection tool recipe creation (defect scan, dark field and bright field) |
| Pra-Syarat | 0 |