Job Description (JD)
| Nama Program | Operasi Fabrikasi Wafer Bahagian Hadapan [EE-022-4:2012] |
|---|---|
| Kod CU | EE-022-4:2012-E01 |
| Competency | Elektif |
| Tajuk CU | Interupt Lot Process (ILP) Handling |
| Penerangan CU | The CU title describes the competency in Interruption Lot Processing (ILP). He or she able to demonstrate competency in handling interrupted lot processing. The person who is competent in this CU shall be able to Practice clean room protocol; Identify affected lot; Review tool error log; Verify the event in the system (ex:CADET); and Dispose affected wafer according to related module procedure. The outcome of this competency is to minimize tool downtime as well as handling issue and event disposition. The personnel who are to be trained for the competency must have Clean room protocol, Wafer Fabrication Process Operation and Wafer Fabrication In line monitoring. |
| Tempoh Latihan | 256 |
| Objektif Pembelajaran | The person who is competent in this CU shall be able to handle interrupted lot processing to minimize tool downtime as well as handling issue and event disposition. Upon completion of this competency unit, trainees will be able to:- 1. Practice cleanroom protocol 2. Identify affected lot 3. Review tool error log 4. Verify the event in the system (CADET) 5. Dispose affected wafer according to related module procedure |
| Pra-Syarat | 0 |