Job Description (JD)
| Nama Program | Operasi Fabrikasi Wafer Bahagian Hadapan [EE-022-4:2012] |
|---|---|
| Kod CU | EE-022-4:2012-C02 |
| Competency | Core |
| Tajuk CU | Wafer Fabrication Manufacturing Operation |
| Penerangan CU | The CU title describes the competency in Wafer Fabrication Manufacturing Operation He or she able to operate the equipments to manufacture wafer in standard operating condition in accordance to standard manufacturing practices to meet customer requirement . The person who is competent in this CU shall be able to Practice cleanroom protocol; Running production (SOP); Perform Daily Qual; Perform inline defect monitoring; Running non- standard process and operation (SERI); Running non-standard operation flow or SOP (TEI); Wafer box/ cassette/ pod control cleaning; Start Lot Procedure; Execute final inspection & packaging; and Handle non- conformance product and disposition - OCAP (out of control action plan). The outcome of this competency is to ensure the wafer delivery on time with quality of the wafer meet customer requirement. |
| Tempoh Latihan | 192 |
| Objektif Pembelajaran | The person who is competent in this CU shall be able to operate the equipments to manufacture wafer in standard operating condition in accordance to standard manufacturing practices to meet customer requirement. Upon completion of this competency unit, trainees will be able to:- 1. Practice cleanroom protocol 2. Running production (SOP) 3. Perform Daily Qual 4. Perform Inline Defect Monitoring 5. Running non-std process and operation 6. Running non-std operation flow or SOP (TEI) 7. Wafer box/ cassette/pod control cleaning 8. Start Lot Procedure 9. Execute final inspection & packaging 10. Handle non-conformance product and disposition - OCAP (Out of Control Action Plan) |
| Pra-Syarat | 0 |