Job Description (JD)
| Nama Program | Operasi Fabrikasi Wafer Bahagian Hadapan [EE-022-4:2012] |
|---|---|
| Kod CU | EE-022-4:2012-C03 |
| Competency | Core |
| Tajuk CU | Wafer Fabrication In Line monitoring |
| Penerangan CU | The CU title describes the competency in Wafer Fabrication In line Monitoring He or she able to perform quality control inspection, interpret data and make decision based on Out of Control Action Plan (OCAP). The person who is competent in this CU shall be able to Practice clean room protocol; Engineering Data Collection (EDC) and Statistical Process Control SPC application monitoring; Perform Visual inspection on wafers; and Carry out scheduled inline defect monitoring and ad-hoc request. (STEM). The outcome of this competency is to ensure the quality of the wafer meet customer requirement. |
| Tempoh Latihan | 152 |
| Objektif Pembelajaran | The person who is competent in this CU shall be able to perform quality control inspection, interpret data and make decision based on Out of Control Action Plan (OCAP) to ensure the quality of the wafer meet customer requirement. Upon completion of this competency unit, trainees will be able to:- 1. Practice cleanroom protocol 2. Engineering Data Collection (EDC) and Statistical Process Control SPC application monitoring 3. Perform Visual inspection on wafers 4. Carry out scheduled inline defect monitoring and ad-hoc request. (STEM) |
| Pra-Syarat | 0 |