Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C03 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR WIRE AND CLIP BONDING |
| Penerangan CU | Semiconductor wire and clip bonding isthe competency in performing wire and clip bonding which is the primary method of making interconnections between an integrated circuit (IC) and a printed circuit board(PCB) during semiconductor device fabrication. Wire and clip bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages The person who is competent in this competency unit shall be able to prepare, set up machine, carry out and inspect semiconductor wire bonding to Check the work requirements and process procedure. The outcome of this competency is to achieve successful process of wire bonding packagedare free from misaligned and product are accurate to parameter within standard time given. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to process of package molding are accurate to exterior surface, free from misaligned or damaged and encapsulation layer patterned design feature are produced in standard time. Upon completion of this competency unit, trainees will be able to:- · Identify wire bonded product for package molding process requirement · Set up machine for package molding process · Carry out package molding process · Inspect package molding product result and quality |
| Pra-Syarat | 0 |