Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C04 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR PACKAGE MOLDING |
| Penerangan CU | Semiconductor package molding is the competency in performing package molding in which multiple semiconductor dies are secured to a single semiconductor support structure which is then inserted into an encapsulation mould. The mould section design feature shapes the top surface of the encapsulation layer. The person who is competent in this competency unit shall be able to prepare, set up machine, carry out and inspect semiconductor package molding to check work requirements and process procedure. The outcome of this competency is to successful process of package molding are accurate to exterior surface, free from misaligned or damaged and encapsulation layer patterned design feature are produced in standard time. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to successfully process lead plating products which are free from damaged or incident, produce with standard time given and result meet the lot traveller information. Upon completion of this competency unit, trainees will be able to:- · Identify moulded package and chemicals lead plating process requirement · Set up machine for lead plating process flow · Inspect lead plating product result and quality · Carry out lead plating corrosion resistance process |
| Pra-Syarat | 0 |