Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C05 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR LEAD PLATING |
| Penerangan CU | Semiconductor lead plating is the competency in performing lead plating where in this process isa lead frame is used with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of lead-free solder on said nickel layer, selectively covering areas of said lead frame intended for attachment to other parts; and a plated layer of palladium on said nickel layer, selectively covering areas of said lead frame intended for bonding wire attachment. The person who is competent in this competency unit shall be able to prepare, set up machine, carry out and inspect semiconductor lead plating to fulfil work requirements and process procedure. The outcome of this competency is to achieve successful process of lead plating are free from damaged or incident, produce with standard time given and result meet the lot traveller information. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be abletrim and forming production are free from damaged or incident, produce with standard time given and result meet the lot traveller information. Upon completion of this competency unit, trainees will be able to:- · Identify lot “ after plating/melding and cure product · Set up machine package trim and form process · Carry out package trim and form process · Inspect package trim and form process |
| Pra-Syarat | 0 |