Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C10 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR PRODUCT PACKING |
| Penerangan CU | This semiconductor product packing is the competency in performing product packing in which is a metal, plastic, glass, or ceramic casing containing one or more semiconductor electronic components. Individual discrete components are typically etched in silicon wafer before being cut and assembled in a package. The package provides protection against impact and corrosion holds the contact pins or leads which are used to connect from external circuits to the device, and dissipates heat produced. The person who is competent in this competency unit shall be able to prepare, set up machine, carry out, inspect and perform outer of semiconductor product packing to work requirements and process procedure. The outcome of this competency is to achieve successful process of product packing production, free from damage, accurate to design quality parameter and produce in given time. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to achieve successful process of product packing production, free from damage, accurate to packing design quality and produced in given time. Upon completion of this competency unit, trainees will be able to:- • Prepare product packing process material, equipment and packing tools • Set up machine readiness for product packing process • Carry out product packing process • Perform outer product packing process and labelling Inspect product packing result and quality. |
| Pra-Syarat | 0 |