Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-E01 |
| Competency | Elektif |
| Tajuk CU | SEMICONDUCTOR WAFER PROBING |
| Penerangan CU | Semiconductor wafer probing is the competency in performing wafer probing in which the dies are first tested to see if they function as designed plan. The semiconductor wafer probing comprises of electrical test conducted on wafers. Probing is done to ensure that the wafer has no inherent problems that may product result and quality in low effectiveness. The person who is competent in this competency unit shall be able to identify wafer product probing functionality test requirement, set up machine, carry out andinspect wafer probing product result and quality to work requirements and process procedure. The outcome of this competency is to achieve successful process of wafer product probing production free from misaligned, product met to quality, produce in time and accurate to parameter against lot traveller. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to achieve successful process of wafer product probing production free from misaligned, product met to quality, produce in time and accurate to parameter against lot traveller. Upon completion of this competency unit, trainees will be able to:- • Identify wafer product probing functionality test requirement • Set up probing machine for wafer probing process to check die functionality • Carry out wafer probing process • Inspect wafer probing result and quality |
| Pra-Syarat | 0 |