Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-E02 |
| Competency | Elektif |
| Tajuk CU | SEMICONDUCTOR WAFER BACK GRINDING |
| Penerangan CU | This semiconductor wafer back grinding the competency in performing back grinding is a device used in fabrication to reduce wafer thickness for stacking and high density packaging of integrated circuits (IC) The person who is competent in this competency unit shall be able to prepare, set up machine and carry out semiconductor wafer back grinding to work requirements and process procedure. The outcome of this competency is to ensure the wafer back grinding production free from dented, undersized, produce within standard quality and met standard time processing . |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able in performing back grinding is a device used in fabrication to reduce wafer thickness for stacking and high density packaging of integrated circuits (IC). Upon completion of this competency unit, trainees will be able to:- • Identify wafer product back grinding as per product requirement • Set up machine for wafer back grinding process to determine wafer thickness • Carry out wafer back grinding process • Inspect wafer back grinding result and quality |
| Pra-Syarat | 0 |